微電子環(huán)境可靠性標準如何選：

隨著當(dāng)前電子信息技術(shù)的發(fā)展，越來越多的微電子器件應(yīng)用于日常生活，使得微電子器件的可靠性問題逐漸凸顯出來，也對微電子的可靠性提出越來越的要求，微電子的可靠性直接關(guān)系到電子備應(yīng)用功能的發(fā)揮。本文介紹了JEDEC的可靠性標準，供您參考。

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JEDEC工業(yè)標準：

環(huán)境應(yīng)力試驗

[JDa1]  JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上電溫濕度循環(huán)壽命試驗, (Revision of JESD22-A100-A) April 2000 [Text-jd001]

[JDa2]  JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上電溫濕度穩(wěn)態(tài)壽命試驗, (Revision of JESD22-A101-A) April 1997 [Text-jd002]

[JDa3]  JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮試驗, (Revision of JESD22-A102-B) December 2000 [Text-jd003]

[JDa4]  JESD22-A103-A Test Method A103-A High Temperature Storage Life高溫儲存壽命試驗, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989 [Text-jd004]

[JDa5]  JESD22-A103-B High Temperature Storage Life高溫儲存壽命試驗, (Revision of JESD22-A103-A) August 2001 [Text-jd005]

[JDa6]  JESD22-A104-B Temperature Cycling溫度循環(huán), (Revision of JESD22-A104-A) July 2000 (參見更新版本A104C) [Text-jd006]

[JDa7]  EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上電和溫度循環(huán), (Revision of Test Method A105-A) February 1996 [Text-jd007]

[JDa8]  JESD22-A106-A Test Method A106-A Thermal Shock熱沖擊, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 [Text-jd008]

[JDa9]  JESD22-A107-A Salt Atmosphere鹽霧試驗, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 [Text-jd009]

[JDa10]  JESD22-A108-B Temperature, Bias, and Operating Life高溫環(huán)境條件下的工作壽命試驗, (Revision of JESD22-A108-A) December 2000

[JDa11]  JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速壽命試驗, (Revision of Test Method A110-A) February 1999 [Text-jd010]

[JDa12]  JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表貼器件在可靠性試驗以前的預(yù)處理, (Revision of Test Method A113-A) March 1999 [Text-jd011]

[JDa13]  JESD22-A118 Accelerated Moisture Resistance - Unbiased HAST不上電的高加速濕氣滲透試驗, December 2000 [Text-jd012]

[JDa14]  JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接溫度試驗, (Revision of Test Method B106-A) February 1999 [Text-jd013]

[JDa15]  EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits集成電路施加應(yīng)力的產(chǎn)品驗收試驗, July 1995 [Text-jd031]

[JDa1]  JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May 2005 [Text-jd040]

電應(yīng)力和電測試試驗：

[JDb1]  JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人體模型條件下的靜電放電敏感度試驗, (Revision of JESD22-A114-A) June 2000 [Text-jd014]

[JDb2]  EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)機器模型條件下的靜電放電敏感度試驗, (Revision of EIA/JESD22-A115) October 1997 [Text-jd015]

[JDb3]  JESD22-A117 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和數(shù)據(jù)保存試驗, January 2000 [Text-jd016]

[JDb4]  EIA/JESD78 IC Latch-Up Test集成電路器件閂鎖試驗, March 1997 [Text-jd017]

[JDb5]  JESD22-C101-A Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components微電子器件在電荷感應(yīng)模型條件下的抗靜電放電試驗, (Revision of JESD22-C101) June 2000  [Text-jd018]

機械應(yīng)力試驗：

[JDc1]  JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振動和掃頻試驗 (Revision of Test Method B103 Previously Published in JESD22-B) July 1989 [Text-jd019]

[JDc2]  JESD22-B104-A Test Method B104-A Mechanical Shock機械沖擊 (Revision of Test Method B104, Previously Published in JEDEC Standard No.22-B) September 1990 [Text-jd020]

[JDc3]    EIA/JESD22-B116 Wire Bond Shear Test Method焊線邦定的剪切試驗方法, July 1998 [Text-jd021]

[JDc4]    JESD22-B117 BGA Ball Shear BGA焊球的剪切試驗, July 2000 [Text-jd022]

[JDc5]  JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006 [Text-jd038]

[JDc6]   JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039]

綜合試驗與測試：

[JDd1]    JEDEC Standard No.22-A109 Test Method A109 Hermeticity密封性試驗, July 1988 [Text-jd023]

[JDd2]    JESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成電路器件中使用的有機材料水分擴散和水溶性測定試驗方法, June 2001 [Text-jd024]

[JDd3]  JESD22-B100-A Physical Dimensions物理尺寸的測量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 [Text-jd025]

[JDd4]  JESD22-B101 Test Method B101 External Visual外觀檢查, (Previously published in JESD22-B) September 1987 [Text-jd026]

[JDd5]    EIA/JESD22-B102-C Solderability Test Method可焊性試驗方法, September 1998 [Text-jd027]

[JDd6]   EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管腳的完整性試驗, (Revision of Test Method B105-A) January 1999 [Text-jd028]

[JDd7]    EIA/JESD22-B107-A Test Method B107-A Marking Permanency圖標的耐久性試驗, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995 [Text-jd029]

[JDd8]    JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表貼半導(dǎo)體器件的共面性試驗, November 1991 [Text-jd030]

其它：

[JDe1]    JEP113-B Symbol and Labels for Moisture-Sensitive Devices濕度敏感器件的符號和標識, (Revision of JEP113-A) May 1999 [Text-jd032]

[JDe2]    EIA/JEP122 Failure Mechanisms and Models for Silicon Semiconductors Devices硅半導(dǎo)體器件的失效機理和模型, February 1996 [Text-jd033]

[JDe3]   IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices針對非密封表貼半導(dǎo)體器件的濕度/回流焊敏感度分類和級別, April 1999 [Text-jd034]

[JDe4]   IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices濕度/回流焊敏感標貼器件的處理、包裝、運輸和使用的標準, May 1999 [Text-jd035]

[JDe5]  EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 [Text-jd036]

[JDe6]  IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices針對非密封表貼半導(dǎo)體器件的濕度/回流焊敏感度分類和級別, Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 [Text-jd037]